Immersion cooling is the process of removing heat from data servers and other components by submerging them in a non-conductive heat transfer liquid. Through years of research and development, Midas has enhanced this process to provide the most effective immersion cooling equipment solution on the market.
Electronic components are submerged in a dielectric liquid where heat from the electronic components is transferred to the fluid. Pumps are used to flow the heated fluid to a heat exchanger, where it is cooled and cycled back into the enclosure.
Designed to maximize server density and power efficiency with a minimal physical footprint, the MIDAS XCI System is over 1,200 times more efficient at dissipating heat than traditional air cooling methods. Each XCI immersion tank can be configured to cool up to 150 kW of compute power and can be located almost anywhere.
A cooling module replaces the traditional cooling infrastructure. Hot-swappable modules can be rolled off for maintenance while a spare takes its place to maintain redundancy. This system provides
active redundancy and allows for concurrent maintainability. Additionally, dry disconnects enable clean and rapid module replacement.
Lower Power Consumption
Minimal Atmospheric Contaminants
No Server Fan Failures
Minimal Oxidation and Corrosion
High Water Usage Efficiency (WUE)
Redundancy & Concurrent Maintainability
|Uptime Inst*||Hyper / Colo||Immersion|
|Standard Server Consumption||1000 W||1000 W||1000 W|
|Minus Fans (5%)||0 W||0 W||150 W|
|Actual Server Consumption||1000 W||1000 W||850 W|
|Cooling Consumption||550 W||350 W||42.5 W|
|Total Power Consumption||1500 W||1350 W||892.5 W|
|Immersion SAVINGS vs Air Cooled||42%||34%||- -|
*2022 Uptime Institute survey average
|Cooling Technology||Water Usage Efficiency||Future Proof||No Extreme Components Temperature Change||No Humidity Issues||IT Equipment Reliability||Mean Time to Repair (MTTR)||Capital Cost||Typical PUE|
|Conventional Air Cooling||1.6|
|Air-Side||1.3 - 1.4|
|Water - Side Economization||1.4 - 1.5|
|Adiabatic (Evaporative)||< 1.2|
|Liquid to the Chip||< 1.2|
|Single Phase Dielectric Cooling||< 1.05|
|2-Phase Dielectric Cooling||< 1.05|
We use our own and third-party cookies to improve our services and show you advertising related to your preferences by analyzing your browsing habits. If you go on surfing, we will consider you accepting its use. You can get more information here.